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Wan, Xinggon; Zhu, Baofu; Mohan, Meera; Wu, Keija; Choi, Dongil; Gondal, Arfa (2019).
[IEEE 2019 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2019.3.31-2019.4.4)] 2019 IEEE International Reliability Physics Symposium (IRPS) - HCI Improvement on 14nm FinFET IO Device by Optimization of 3D Junction Profile. , (), 1–4.
doi:10.1109/IRPS.2019.8720526
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